Search

Now showing items 1-2 of 2

Observation of Joule Heating-Assisted Electromigration Failure Mechanisms for Dual Damascene Cu/SiO₂ Interconnects

Chang, Choon Wai; Gan, C.L.; Thompson, Carl V.; Pey, Kin Leong; Choi, Wee Kiong (2003-01)

Failure mechanisms observed in electromigration (EM) stressed dual damascene Cu/SiO₂ interconnects trees were studied and simulated. Failure sites with â€˜melt patch’ or â€˜crater’ are common for test structures in the top ...

Mortality Dependence of Cu Dual Damascene Interconnects on Adjacent Segments

Chang, Choon Wai; Gan, C.L.; Thompson, Carl V.; Pey, Kin Leong; Choi, Wee Kiong; e.a. (2004-01)

Electromigration experiments have been carried out on straight interconnects that have single vias at each end, and are divided into two segments by a via in the center ("dotted-I" structures). For dotted-i structures in ...