Reversible concentric ring microfluidic interconnects

Abstract

A reversible, Chip-to-Chip microfluidic interconnect was designed for use in high temperature, high pressure applications such as chemical microreactor systems. The interconnect uses two sets of concentric, interlocking rings with trapezoidal cross sections to form a fluid seal without the use of gaskets or sealants. Results from analytical and finite element models indicate good sealing capability. Macro scale devices show that the interconnects function as designed and seal up to 80 psi. Micro scale devices have been fabricated, engage as designed and are much stronger than anticipated, however pressure tests have not yet been conducted.