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dc.contributor.authorGupta, Saurabh
dc.contributor.authorLee, Minjoo L.
dc.contributor.authorLeitz, Christopher W.
dc.contributor.authorFitzgerald, Eugene A.
dc.date.accessioned2003-12-13T16:54:41Z
dc.date.available2003-12-13T16:54:41Z
dc.date.issued2004-01
dc.identifier.urihttp://hdl.handle.net/1721.1/3830
dc.description.abstractPMOS and NMOS mobility characteristics of the dual channel (strained Si/strained Ge) heterostructure have been reviewed. It is shown that the dual channel heterostructure can provide substantially enhanced mobilities for both electrons and holes. However, germanium interdiffusion from the germanium rich buried layer into the underlying buffer layer could potentially reduce the hole mobility enhancements.en
dc.description.sponsorshipSingapore-MIT Alliance (SMA)en
dc.format.extent308344 bytes
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.relation.ispartofseriesAdvanced Materials for Micro- and Nano-Systems (AMMNS);
dc.subjectstrained-Geen
dc.subjectSiGeen
dc.subjectgermaniumen
dc.subjectMOSFETen
dc.subjectmobilityen
dc.subjectstrained-Sien
dc.subjectpMOSFETen
dc.subjectnMOSFETen
dc.subjectgermanium-diffusionen
dc.titleHigh hole and electron mobilities using Strained Si/Strained Ge heterostructuresen
dc.typeArticleen


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