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dc.contributor.authorFu, Yongqing
dc.contributor.authorDu, Hejun
dc.contributor.authorHuang, Weimin
dc.contributor.authorZhang, Sam
dc.contributor.authorHu, Min
dc.date.accessioned2003-12-13T17:59:05Z
dc.date.available2003-12-13T17:59:05Z
dc.date.issued2004-01
dc.identifier.urihttp://hdl.handle.net/1721.1/3844
dc.description.abstractIn this paper, some critical issues and problems in the development of TiNi thin films were discussed, including preparation and characterization considerations, residual stress and adhesion, frequency improvement, fatigue and stability, as well as functionally graded or composite thin film design. Different types of MEMS applications were reviewed and the prospects for future advances in fabrication process and device development were discussed.en
dc.description.sponsorshipSingapore-MIT Alliance (SMA)en
dc.format.extent297584 bytes
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.relation.ispartofseriesAdvanced Materials for Micro- and Nano-Systems (AMMNS);
dc.subjectshape-memoryen
dc.subjectTiNien
dc.subjectsputteringen
dc.subjectthin filmsen
dc.subjectMEMSen
dc.subjectmicroactuatoren
dc.subjectmicrosensoren
dc.titleTiNi-based thin films for MEMS applicationsen
dc.typeArticleen


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