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dc.contributor.advisorLynette A. Jones.en_US
dc.contributor.authorHo, Hsin-Nien_US
dc.contributor.otherMassachusetts Institute of Technology. Dept. of Mechanical Engineering.en_US
dc.date.accessioned2007-08-29T20:46:08Z
dc.date.available2007-08-29T20:46:08Z
dc.date.copyright2007en_US
dc.date.issued2007en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/38696
dc.descriptionThesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2007.en_US
dc.descriptionIncludes bibliographical references (leaves 147-152).en_US
dc.description.abstractThe thermal interaction between the skin and an object is influenced by the thermal properties and initial temperatures of the skin and object, and by the contact force and surface roughness of the contact surfaces. This thermal interaction is modeled in this research which characterizes the transient thermal responses during contact. The thermal model was evaluated in psychophysical and physiological experiments by determining whether simulated thermal feedback generated based on the model was capable of conveying information to users that was similar to that provided by real materials, and by comparing the temperature responses of the skin predicted by the model and elicited by real materials. In order to obtain precise skin temperature measurements, an infrared thermal measurement system was designed to overcome the limitations imposed by thermal sensors and to determine the influence of contact pressure on the skin temperature responses during contact. The results from the psychophysical and physiological experiments validated the thermal model proposed in this research within the typical contact force range of manual exploration. A thermal display based on this model is able to convey thermal cues that can be used to perceive and identify objects as effectively as those provided by real materials.en_US
dc.description.statementofresponsibilityby Hsin-Ni Ho.en_US
dc.format.extent152 leavesen_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582
dc.subjectMechanical Engineering.en_US
dc.titleDevelopment and evaluation of a thermal model for haptic interfacesen_US
dc.typeThesisen_US
dc.description.degreePh.D.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineering
dc.identifier.oclc165157451en_US


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