RM³ Processing for In-plane Optical Interconnects on Si-CMOS and the Impact of Topographic Features on Losses in Deposited Dielectric Waveguides
Author(s)Barkley, Edward; Fonstad, Clifton G. Jr.
This paper describes recent progress in a continuing program to develop and apply RM³ (recess mounting with monolithic metallization) technologies for heterogeneous integration. Particular emphasis is placed on the applicability of RM³ integration to in-plane geometries for on-chip optical clock and signal distribution and on the suitability of commercially processed IC wafers for use as substrates for rectangular dielectric waveguides.
Advanced Materials for Micro- and Nano-Systems (AMMNS);
optoelectronic integration, heterogeneous integration, hybrid assembly, in-plane laser diodes, rectangular dielectric waveguides