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dc.contributor.advisorEugene A. Fitzgerald.en_US
dc.contributor.authorLiang, Yu Yanen_US
dc.contributor.otherMassachusetts Institute of Technology. Dept. of Materials Science and Engineering.en_US
dc.date.accessioned2009-04-29T17:30:41Z
dc.date.available2009-04-29T17:30:41Z
dc.date.copyright2008en_US
dc.date.issued2008en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/45361
dc.descriptionThesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2008.en_US
dc.descriptionIncludes bibliographical references (leaf 40).en_US
dc.description.abstractThe commercial potential of SOLES (Silicon on Lattice-Engineered Substrate) is investigated considering the competing technologies, competing market players and market demands. Monolithic integration of Si devices with III-V electronic devices using SOLES could be used to produce single chip wireless IC, catering the need of the most prosperous consumer markets, the mobile phone market and the WLAN/WMAN/WWAN wireless connectivity market. A cost model has been developed to justify the cost effectiveness of single chip wireless IC. The commercial viability of SOLES is commented based on these analyses.en_US
dc.description.statementofresponsibilityby Yu Yan Liang.en_US
dc.format.extent74 leavesen_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectMaterials Science and Engineering.en_US
dc.titleCommercialization of silicon on lattice-engineered substrate for electronic applicationsen_US
dc.typeThesisen_US
dc.description.degreeM.Eng.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineering
dc.identifier.oclc316803479en_US


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