dc.contributor.advisor | Christopher A. Schuh. | en_US |
dc.contributor.author | Lei, Wang S | en_US |
dc.contributor.other | Massachusetts Institute of Technology. Dept. of Materials Science and Engineering. | en_US |
dc.date.accessioned | 2009-04-29T17:33:59Z | |
dc.date.available | 2009-04-29T17:33:59Z | |
dc.date.copyright | 2008 | en_US |
dc.date.issued | 2008 | en_US |
dc.identifier.uri | http://hdl.handle.net/1721.1/45385 | |
dc.description | Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2008. | en_US |
dc.description | Includes bibliographical references (leaves 21-22). | en_US |
dc.description.abstract | Silicon has long been used as an alloying element in various metal alloys, in engineered ceramics, and in the semiconductor industry. However, due to its intrinsic low fracture toughness, it is generally perceived as a poor choice of material for mechanical applications. This study explores some potential short and long term applications for a new type of castable silicon-rich alloy with an increased fracture toughness, by utilizing several different material selection indices. | en_US |
dc.description.statementofresponsibility | by Wang S. Lei. | en_US |
dc.format.extent | 22 leaves | en_US |
dc.language.iso | eng | en_US |
dc.publisher | Massachusetts Institute of Technology | en_US |
dc.rights | M.I.T. theses are protected by
copyright. They may be viewed from this source for any purpose, but
reproduction or distribution in any format is prohibited without written
permission. See provided URL for inquiries about permission. | en_US |
dc.rights.uri | http://dspace.mit.edu/handle/1721.1/7582 | en_US |
dc.subject | Materials Science and Engineering. | en_US |
dc.title | Potential applications of a toughened silicon-based alloy | en_US |
dc.type | Thesis | en_US |
dc.description.degree | M.Eng. | en_US |
dc.contributor.department | Massachusetts Institute of Technology. Department of Materials Science and Engineering | |
dc.identifier.oclc | 317399422 | en_US |