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dc.contributor.advisorNeil Gershenfeld.en_US
dc.contributor.authorAnderson, Pehr C. (Pehr Christian), 1974-en_US
dc.date.accessioned2009-06-30T18:27:50Z
dc.date.available2009-06-30T18:27:50Z
dc.date.copyright1998en_US
dc.date.issued1998en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/46249
dc.descriptionThesis (M.Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1998.en_US
dc.descriptionIncludes bibliographical references (leaf 63).en_US
dc.description.abstractFilaments are low-cost interfaces for attaching devices to an Ethernet network. While most networking research pushes for faster high-end systems, the filament project targets low-end devices with the goal of making networking easy. Filaments wrap the complexity of the network into a simple and convenient package. The vast majority of device communications require only a tiny thread or filament of connectivity. Before filaments, one could either tie each device to a desktop PC or to deploy a specialized device network. Filaments allow you to leverage the same network used by desktop computers without making devices dependent on them.en_US
dc.description.statementofresponsibilityby Pehr C. Anderson.en_US
dc.format.extent63 leavesen_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectElectrical Engineering and Computer Scienceen_US
dc.titleFilaments : lightweight network interfaces for embedded devicesen_US
dc.title.alternativefilament chip : implementing embedded networksen_US
dc.typeThesisen_US
dc.description.degreeM.Eng.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Scienceen_US
dc.identifier.oclc42278264en_US


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