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dc.contributor.advisorWilliam Robbins and Yet-Ming Chiang.en_US
dc.contributor.authorBennett, Joshua V. (Joshua Victor)en_US
dc.contributor.otherMassachusetts Institute of Technology. Dept. of Materials Science and Engineering.en_US
dc.date.accessioned2009-06-30T18:51:15Z
dc.date.available2009-06-30T18:51:15Z
dc.date.copyright1997en_US
dc.date.issued1997en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/46285
dc.descriptionThesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1997.en_US
dc.descriptionIncludes bibliographical references (leaf 48).en_US
dc.description.abstractThis paper describes the engineering and development of a process to electrically and mechanically bond a large area, backlit charge-coupled device (CCD) sensor to a metallized substrate, using a materials system compatible with a high vacuum tube configuration. The CCD sensor is used in light sensor and digital camera devices. Currently, CCD devices are mechanically bonded to substrates using a variety of polymeric materials. For maximum resolution, however, the device must operate at high vacuum. Polymers release monomer molecules when exposed to a vacuum, since the polymerization reaction is far from equilibrium. Polymers also release retained solvent and binder molecules into a vacuum. This release of gas pollutes the high vacuum environment and degrades the tube perfomance. The CCD chip used in this research is extremely large, compared with standard semiconductor devices. The CCD chip measures 0.4 x 0.5 inches. At this size scale, thermal expansion mismatch stresses between die and carrier become an important design consideration, particularly for a die thinned to 10 micrometers. The proposed process results in a mechanical bond that is compatible with the high vacuum requirement, and is applicable to substrates of four possible materials: silicon, aluminum nitride, Pyrex, and LZS (a zirconia/ silicon nitride composite). The process also allows for two possible electrical connection techniques.en_US
dc.description.statementofresponsibilityby Joshua V. Bennett.en_US
dc.format.extent48 leavesen_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectMaterials Science and Engineering.en_US
dc.titlePackaging and interconnection of a black-lit CCD sensor deviceen_US
dc.title.alternativePackaging and interconnection of a black-lit charged coupled device sensor deviceen_US
dc.typeThesisen_US
dc.description.degreeM.S.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Dept. of Materials Science and Engineering.en_US
dc.identifier.oclc52925598en_US


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