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dc.contributor.advisorDavid K. Roylance.en_US
dc.contributor.authorChiang, Diana C. (Diana Chih-Chan), 1975-en_US
dc.date.accessioned2010-01-07T20:41:16Z
dc.date.available2010-01-07T20:41:16Z
dc.date.copyright1998en_US
dc.date.issued1998en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/50454
dc.descriptionThesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1998.en_US
dc.descriptionIncludes bibliographical references (leaf 34).en_US
dc.description.abstractSix underfill materials were examined for the selection of an appropriate underfill material for Digital Equipment Corporation's flip chip development project. Several tests were performed to determine the material properties, process properties, and the reliability of each underfill material. A material with a fast flow rate, uniform and void free flow pattern, fast curing schedule, good thermal and mechanical properties, and good reliability results is needed to satisfy the requirements for this project. Materials F and E exhibited all the above requirements and were concluded as the two best underfill materials for the flip chip process. Important material properties which contributed to the desired results of these materials include a filler particle content of about 65%, a weight loss percentage during cure of less than 1%, and a Tg of 140°C.en_US
dc.description.statementofresponsibilityby Diana C. Chiang.en_US
dc.format.extent34 leavesen_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectMaterials Science and Engineeringen_US
dc.titleUnderfill material selection for flip chip technologyen_US
dc.typeThesisen_US
dc.description.degreeS.M.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineeringen_US
dc.identifier.oclc42075763en_US


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