| dc.contributor.advisor | Evelyn N. Wang. | en_US |
| dc.contributor.author | Ruleman, Karlen E. (Karlen Elizabeth) | en_US |
| dc.contributor.other | Massachusetts Institute of Technology. Dept. of Mechanical Engineering. | en_US |
| dc.date.accessioned | 2010-04-28T15:44:15Z | |
| dc.date.available | 2010-04-28T15:44:15Z | |
| dc.date.copyright | 2009 | en_US |
| dc.date.issued | 2009 | en_US |
| dc.identifier.uri | http://hdl.handle.net/1721.1/54510 | |
| dc.description | Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2009. | en_US |
| dc.description | Cataloged from PDF version of thesis. | en_US |
| dc.description | Includes bibliographical references (p. 22). | en_US |
| dc.description.abstract | Dropwise condensation has the potential to greatly increase heat transfer rates. Heat transfer coefficients by dropwise condensation and film condensation on microstructured silicon chips were compared. Heat transfer coefficients are found to be seventy percent higher in the hydrophobic, dropwise condensation case relative to the hydrophilic, film condensation case. With this increased heat transfer coefficient, dropwise condensation using microstructures could improve many heat exchange applications, particularly electronics cooling. | en_US |
| dc.description.statementofresponsibility | by Karlen E. Ruleman. | en_US |
| dc.format.extent | 24 p. | en_US |
| dc.language.iso | eng | en_US |
| dc.publisher | Massachusetts Institute of Technology | en_US |
| dc.rights | M.I.T. theses are protected by
copyright. They may be viewed from this source for any purpose, but
reproduction or distribution in any format is prohibited without written
permission. See provided URL for inquiries about permission. | en_US |
| dc.rights.uri | http://dspace.mit.edu/handle/1721.1/7582 | en_US |
| dc.subject | Mechanical Engineering. | en_US |
| dc.title | Heat transfer via dropwise condensation on hydrophobic microstructured surfaces | en_US |
| dc.type | Thesis | en_US |
| dc.description.degree | S.B. | en_US |
| dc.contributor.department | Massachusetts Institute of Technology. Department of Mechanical Engineering | |
| dc.identifier.oclc | 558876151 | en_US |
