Browsing Warren M. Rohsenow Heat and Mass Transfer Laboratory by Title
Now showing items 14-29 of 29
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MEMS-based thermal management of high heat flux devices edifice: Embedded droplet impingement for integrated cooling of electronics
(2003-05)Increases in microprocessor power dissipation coupled with reductions in feature sizes due to manufacturing process improvements have resulted in continuously increasing heat fluxes. The ever increasing chip-level heat ... -
Microscale thermal engineering of electronic systems
(2003-05)The electronics industry is encountering thermal challenges and opportunities with lengthscales comparable to or much less than one micrometer. Examples include nanoscale phonon hotspots in transistors and the increasing ... -
Nanoscale heat transfer and information technology
(2003-05)The summary from Goodson’s group on their recent work on heat transfer issues in the microelectronics and data storage industries illustrate the critical role of heat transfer for some areas of information technology. ... -
Nanoscale transport phenomena at the interface of hard and soft matter
(2003-05)Hard and soft matter can be distinguished by the energy of chemical bonds in comparison with kBT. At the interface of hard and soft matter, there exists a region of transition between strong (covalent/ionic/metallic) ... -
Nanostructures and energy conversion
(2003-05)The unique properties of nanostructures associated with their low dimensionality give rise to new opportunities for research on nanoscale heat transfer and energy conversion. Inspired by Majumdar’s analysis of the novel ... -
PHASE CHANGE HEAT TRANSFER – A PERSPECTIVE FOR THE FUTURE
(2003-05)During the last half of the twentieth century, significant advances have been made in developing an understanding of phase change heat transfer (e.g., boiling and condensation). Further advances in phase change heat ... -
Rohsenow Symposium web page
(2004-10-28) -
Samuel C. Collins
(2004-09-30) -
Silas W. Holman
(2004-09-29) -
Thermal control of electronics: Perspectives and prospects
(2003-05)One of the most prominent industrial applications of heat transfer science and engineering has been electronics thermal control. Driven by the relentless increase in spatial density of microelectronic devices, integrated ... -
Warren M. Rohsenow
(2004-09-30)
