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Orienting Silicon Integrated Circuit Chips for Lead Bonding

Author(s)
Horn, Berthold K.P.
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Abstract
Will computers that see and understand what they see revolutionize industry by automating the part orientation and part inspection processes? There are two obstacles: the expense of computin and our feeble understanding of images. We believe these obstacles are fast ending. To illustrate what can be done we describe a working program that visually determines the position and orientation of silicon chips used in integrated circuits.
Date issued
1975-01-01
URI
http://hdl.handle.net/1721.1/5799
Other identifiers
AIM-323
Series/Report no.
AIM-323

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  • AI Memos (1959 - 2004)

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