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dc.contributor.advisorYoel Fink.en_US
dc.contributor.authorDeng, Daoshengen_US
dc.contributor.otherMassachusetts Institute of Technology. Dept. of Materials Science and Engineering.en_US
dc.date.accessioned2010-10-29T18:17:35Z
dc.date.available2010-10-29T18:17:35Z
dc.date.copyright2010en_US
dc.date.issued2010en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/59705
dc.descriptionThesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2010.en_US
dc.descriptionCataloged from PDF version of thesis.en_US
dc.descriptionIncludes bibliographical references (p. 107-112).en_US
dc.description.abstractOne-dimensional nanostructures with high aspect-ratios and nanometer cross-sectional dimensions have been the focus of recent studies in the persistent drive to miniaturize devices. Conventional bottom-up methods such as vapor-liquid-solid growth have been widely applied for the fabrication of uniform and high quality nanowires. Two challenges toward nanoelectronics and other applications remain: on the single-nanowire level, precisely manipulating an individual nanowire for the sophisticated functionalities, and on the multiple-nanowire level, integrating nanowires into designed architecture at large scale. Thus, an alternative approach with the capacity to achieve ordered and extended nanowires is highly desirable. In this thesis, we observe an intriguing phenomenon that a cylindrical shell upon reaching a characteristic thickness breaks up into filament arrays during optical-fiber thermal drawing. This structural evolution occurs exclusively in the cross-sectional plane, while the uniformity along the axial direction remains intact. We demonstrate crystalline semiconductor nanowires by post-drawing annealing procedure and characterize their electrical and optoelectric properties for the devices such as optical switch. This top-down thermal drawing approach provides new opportunities for nanostructure fabrication with high throughput and at low cost, and offers promising applications in renewable energy and data storage. In order to understand the stability (or instability) of thin shells and filaments, we explore a physical mechanism during the complicated thermal drawing. A perspective of capillary instability from fluid mechanics is focused. Axial stability of continuous filaments is consistent with capillary instability. Axial stability of a thicker cylindrical shell arises from large radius and high viscosity. These results provide theoretical guidance in the understanding of attainable feature sizes and in materials selection to expand the potential functionalities of devices in microstructured fibers.en_US
dc.description.statementofresponsibilityby Daosheng Deng.en_US
dc.format.extent112 p.en_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectMaterials Science and Engineering.en_US
dc.titleIn-fiber semiconductor filament arraysen_US
dc.typeThesisen_US
dc.description.degreePh.D.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineering
dc.identifier.oclc668422375en_US


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