Show simple item record

dc.contributor.advisorJung-Hoon Chun.en_US
dc.contributor.authorKim, Won, S.M. Massachusetts Institute of Technologyen_US
dc.contributor.otherMassachusetts Institute of Technology. Dept. of Mechanical Engineering.en_US
dc.date.accessioned2011-08-18T19:16:26Z
dc.date.available2011-08-18T19:16:26Z
dc.date.copyright2010en_US
dc.date.issued2010en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/65307
dc.descriptionThesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2010.en_US
dc.descriptionCataloged from PDF version of thesis.en_US
dc.descriptionIncludes bibliographical references (p. 81-84).en_US
dc.description.abstractIn the pharmaceutical industry, the conventional tablet manufacturing process, a batch-based process based on solid powder handling, presents challenges such as inhomogeneous blending between Active Pharmaceutical Ingredients (APIs) and excipients, low yield, and low production rate. These difficulties can be resolved by the realization of a continuous manufacturing process through co-processing of APIs and excipients in the liquid-phase solution. A solvent-cast thin film, produced from liquid solution, can then be manufactured into tablets by way of a folding process. In order to design detailed compaction processes and machines, required compression pressure for layer bonding and mechanical properties of materials should also be investigated. The bonding strength of solvent-cast thin film layers was quantitatively measured by lap shear test. Based on this measurement, bonding threshold pressure was proposed as an indicator showing degree of bonding. At the same time, the layer bonding mechanism of solvent-cast thin films was interpreted as an interdiffusion of amorphous polymer chain end segments. In this context, relative contact area, polymer mobility, which is measured by glass transition temperature, and dwell time were proposed as critical factors in determining bonding threshold pressure. The relationships between those critical factors and process parameters such as surface roughness, residual water and excipient concentration, and compression rate were investigated. The mechanical and viscoelastic properties of solvent-cast thin films were also characterized. Solvent-cast thin films showed ductile-brittle transition, i.e., change of indentation hardness and strength factors among tensile properties with respect to residual water concentration. Changes of creep modulus and tensile properties at various stress levels and strain rates were also observed.en_US
dc.description.statementofresponsibilityby Won Kim.en_US
dc.format.extent84 p.en_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectMechanical Engineering.en_US
dc.titleLayer bonding of solvent-cast thin films for pharmaceutical solid dosage formsen_US
dc.typeThesisen_US
dc.description.degreeS.M.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Dept. of Mechanical Engineering.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineering
dc.identifier.oclc745767792en_US


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record