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The development of an innovative bonding method for microfluidic applications

Author(s)
Lustrino, Michelle E. (Michelle Elizabeth)
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Alternative title
development of an innovative bonding process for microfluidic applications
Other Contributors
Massachusetts Institute of Technology. Dept. of Mechanical Engineering.
Advisor
David E. Hardt.
Terms of use
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582
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Abstract
The field of microfluidics has powerful applications in low-cost healthcare diagnostics, DNA analysis, and fuel cells, among others. As the field moves towards commercialization, the ability to robustly manufacture these devices at low cost is becoming more important. One of the many challenges in microfluidic manufacturing is the reliable sealing of the microfluidic chips once the channels have been generated. This work was an investigation of innovative ways to robustly heat the substrate-cover plate interface of a microfluidic device for the purpose of bonding and sealing the microfluidic channels. An extensive literature review revealed the benefits of interfacial heating, and both simulations and experimental investigations were used to evaluate a few different methods. Ultimately, a unique method was established that uses light to provide both the bonding energy and the illumination for an in-process vision system for real-time viewing and control of the bonding process. The process results in the generation of a homogenous and optically clear bond, and preliminary tests show that when properly controlled, a bond with minimal microchannel deformation can be created.
Description
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2011.
 
Cataloged from PDF version of thesis.
 
Includes bibliographical references (p. 145-149).
 
Date issued
2011
URI
http://hdl.handle.net/1721.1/67622
Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
Publisher
Massachusetts Institute of Technology
Keywords
Mechanical Engineering.

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