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dc.contributor.advisorJung Hoon Chun.en_US
dc.contributor.authorMukherjee, Ishanen_US
dc.contributor.otherMassachusetts Institute of Technology. Dept. of Mechanical Engineering.en_US
dc.date.accessioned2012-02-29T18:21:05Z
dc.date.available2012-02-29T18:21:05Z
dc.date.copyright2011en_US
dc.date.issued2011en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/69490
dc.descriptionThesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2011.en_US
dc.descriptionCataloged from PDF version of thesis.en_US
dc.descriptionIncludes bibliographical references (p. 83-84).en_US
dc.description.abstractThe cleaning process in the surface mount assembly line of power modules had been found to insufficiently remove solder flux residue from printed circuit board (PCB) assemblies after the process of reflow soldering. This thesis details the development of an optimized cleaning process that effectively removes solder flux residue from PCB assemblies. The first stage of this study involves the experimental validation of root cause of process ineffectiveness. A novel visual inspection based grading scale is developed to quantify the amount of residue present. Using the grading scale optimal process parameters were identified and studied. The study finds that power modules are most effectively cleaned in a saponifier based cleaning solution using ultrasonic agitation. Power modules are completely cleaned when washed in an ultrasonic bath at 60°C for 7 minutes, in a saponifier based cleaning solution that is 5% concentration by volume.en_US
dc.description.statementofresponsibilityby Ishan Mukherjee.en_US
dc.format.extent84 p.en_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectMechanical Engineering.en_US
dc.titleCleaning process development and optimization in the surface mount assembly line of power modulesen_US
dc.typeThesisen_US
dc.description.degreeM.Eng.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineering
dc.identifier.oclc775602612en_US


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