Surface mounted PCB cleaning process improvement and Its impact on manufacturing system performance
Name
775602890-MIT.pdf
Description
Full printable version
Size
11.14 MB
Format
Adobe PDF
Checksum (MD5)
4ffec6ec30b24ae10e9ada6671ba9ee4
Author(s)
Rajendran, Nikith
Advisor(s)
Jung Hoon Chun.
Alternative Title
Surface mounted printed circuit board cleaning process improvement and Its impact on manufacturing system performance
Date Issued
2011
Publisher
Massachusetts Institute of Technology
Abstract
In the surface mount technology (SMT) assembly line, the printed circuit boards (PCB) are washed to remove the solder flux that was used while soldering to prevent oxidation. However the current cleaning method is highly ineffective in removing these solder flux residues. The solder flux residues cause many problems like electro-migration, improper mold underfill and increase the chances of failure. This project explores alternative methods for the cleaning process and also identifies the important factors involved in cleaning. A model of the SMT assembly line was created using ARENA software and the impact of the different alternatives on the manufacturing system's performance was analyzed using this model. The results indicate that the use of chemicals in the ultrasonic cleaning method gives the best cleanliness performance. The results of the manufacturing system analysis show that the PCB cleaning process is not the bottleneck process in the SMT line and hence none of the different alternatives significantly impacted the throughput rate, cycle time and inventory levels. Cost comparison results also indicate that using chemicals in the batch type ultrasonic machine was atleast 25% cheaper than using chemicals in either centrifugal machine or in in-line machine.
Description
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2011.
Cataloged from PDF version of thesis.
Includes bibliographical references (p. 87-88).
Subjects
Mechanical Engineering.
MIT Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
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copyright. They may be viewed from this source for any purpose, but
reproduction or distribution in any format is prohibited without written
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