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dc.contributor.advisorCullen R. Buie.en_US
dc.contributor.authorHidayah, Rand (Rand G.)en_US
dc.contributor.otherMassachusetts Institute of Technology. Dept. of Mechanical Engineering.en_US
dc.date.accessioned2012-10-26T18:09:18Z
dc.date.available2012-10-26T18:09:18Z
dc.date.copyright2012en_US
dc.date.issued2012en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/74442
dc.descriptionThesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2012.en_US
dc.descriptionCataloged from PDF version of thesis.en_US
dc.descriptionIncludes bibliographical references (p. 36).en_US
dc.description.abstractInsulator based dielectrophoresis (iDEP) is a technique used for sorting microparticles based on their electrical properties which proves to be promising in its development. Using multiple constrictions of area to generate gradients of electric fields allows a device to be made without electrode arrays and at a cheaper cost. The possibility of making devices with multiple constrictions within them is undertaken using micromachining and adhesion methods. The micromachining of multiple constrictions is planned out but further work is needed for optimization. A concept for a commercial device is proposed for low cost fabrication of 3D iDEP devices.en_US
dc.description.statementofresponsibilityby Rand Hidayah.en_US
dc.format.extent44 p.en_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectMechanical Engineering.en_US
dc.titleDesign of multiple constriction ratio microfluidic channels for 3D insulator based dielectrophoretic chipsen_US
dc.typeThesisen_US
dc.description.degreeS.B.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineering
dc.identifier.oclc813167044en_US


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