Plasma polymerization of C[subscript 4]F[subscript 8] thin film on high aspect ratio silicon molds
Author(s)Yeo, L. P.; Poh, S. L.; Lam, Yee Cheong; Chan-Park, Mary Bee-Eng
Plasma polymerization of C4F8 thin film on high aspect ratio silicon molds
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High aspect ratio polymeric micro-patterns are ubiquitous in many fields ranging from sensors, actuators, optics, fluidics and medical. Second generation PDMS molds are replicated against first generation silicon molds created by deep reactive ion etching. In order to ensure successful demolding, the silicon molds are coated with a thin layer of C[subscript 4]F[subscript 8] plasma polymer to reduce the adhesion force. Peel force and demolding status are used to determine if delamination is successful. Response surface method is employed to provide insights on how changes in coil power, passivating time and gas flow conditions affect plasma polymerization of C[subscript 4]F[subscript 8].
Innovation in Manufacturing Systems and Technology (IMST);
C4F8, plasma polymerization, peel force, demolding