Now showing items 1-2 of 2
Design tool and methodologies for interconnect reliability analysis in integrated circuits
(Massachusetts Institute of Technology, 2004)
ERNI-3D : a technology-generic tool for interconnect reliability projections in 3D integrated circuits
(Massachusetts Institute of Technology, 2001)
Recent developments in semiconductor processing technology has enabled the fabrication of a single integrated circuit (IC) with multiple device-interconnect layers or wafers stacked on each other. This approach is commonly ...