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dc.contributor.advisorVladimir Bulovic.en_US
dc.contributor.authorRamanan, Sulinyaen_US
dc.contributor.otherMassachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science.en_US
dc.date.accessioned2013-02-14T15:40:38Z
dc.date.available2013-02-14T15:40:38Z
dc.date.copyright2012en_US
dc.date.issued2012en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/77034
dc.descriptionThesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2012.en_US
dc.descriptionCataloged from PDF version of thesis.en_US
dc.descriptionIncludes bibliographical references (p. 87-89).en_US
dc.description.abstractIn this thesis, a novel diffusion-based contact-printing technology is investigated, by which a wide variety of low molecular weight organic materials can be patterned without added temperature, pressure, or chemical processing, with just the use of relief-patterned polymeric (PDMS) stamps. It is determined that the diffusion of organic molecules into the polymer matrix is a solvent-assisted process in which mobile oligomers aid in the removal of organic material. It is further shown that using composite stamps, organic films can be patterned at a sub-100 nm length scale. Among other features, this patterning process has enabled patterning of Organic Light Emitting Diodes on a wavelength scale to reduce total internal reflection and thereby enhance the outcoupling of light from the device.en_US
dc.description.statementofresponsibilityby Sulinya Ramanan.en_US
dc.format.extent89 p.en_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectElectrical Engineering and Computer Science.en_US
dc.titleElastomeric contact printing for sub-micron patterning of organic filmsen_US
dc.typeThesisen_US
dc.description.degreeM.Eng.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
dc.identifier.oclc825819530en_US


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