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dc.contributor.authorZiebell, Tiffany D.
dc.contributor.authorSchuh, Christopher A.
dc.date.accessioned2013-08-05T18:16:51Z
dc.date.available2013-08-05T18:16:51Z
dc.date.issued2012-03
dc.date.submitted2011-09
dc.identifier.issn0884-2914
dc.identifier.issn2044-5326
dc.identifier.urihttp://hdl.handle.net/1721.1/79788
dc.description.abstractCharacterizing the residual stress of thick nanocrystalline electrodeposits poses several unique challenges due to their fine grain structure, thickness distribution, and matte surface. We use a three-dimensional profilometry-based approach that addresses each of these complicating factors and enables quantitative analysis of residual stress with reasonable accuracy. The specific emphasis of this work is on thick (10–100 μm), nanocrystalline Ni-W electrodeposits of the finest grain sizes (4–63 nm), in which residual stresses arise during the deposition process as well as during postdeposition annealing. The present measurements offer quantitative insight into the mechanisms of stress development and evolution in these alloys, suggesting that the grain boundary structure is out of equilibrium (unrelaxed) and contains the excess free volume that controls the resulting residual stress levels in these films. There are apparently two factors contributing to this stress: the percentage of excess free volume contained in the grain boundaries, which is affected by the processing conditions, and the total volume fraction of grain boundaries, which is controlled by the grain size.en_US
dc.description.sponsorshipNational Science Foundation (U.S.) (Grant DMI-0620304)en_US
dc.description.sponsorshipAmerican Society for Engineering Education. National Defense Science and Engineering Graduate Fellowshipen_US
dc.description.sponsorshipUnited States. Air Force Office of Scientific Researchen_US
dc.description.sponsorshipNational Science Foundation (U.S.). Graduate Research Fellowship Programen_US
dc.language.isoen_US
dc.publisherCambridge University Press (Materials Research Society)en_US
dc.relation.isversionofhttp://dx.doi.org/10.1557/jmr.2012.51en_US
dc.rightsArticle is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.en_US
dc.sourceMIT web domainen_US
dc.titleResidual stress in electrodeposited nanocrystalline nickel-tungsten coatingsen_US
dc.typeArticleen_US
dc.identifier.citationZiebell, Tiffany D., and Christopher A. Schuh. “Residual stress in electrodeposited nanocrystalline nickel-tungsten coatings.” Journal of Materials Research 27, no. 09 (May 13, 2012): 1271-1284. © Materials Research Society 2012en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineeringen_US
dc.contributor.mitauthorZiebell, Tiffany D.en_US
dc.contributor.mitauthorSchuh, Christopher A.en_US
dc.relation.journalJournal of Materials Researchen_US
dc.eprint.versionFinal published versionen_US
dc.type.urihttp://purl.org/eprint/type/JournalArticleen_US
eprint.statushttp://purl.org/eprint/status/PeerRevieweden_US
dspace.orderedauthorsZiebell, Tiffany D.; Schuh, Christopher A.en_US
dc.identifier.orcidhttps://orcid.org/0000-0001-9856-2682
mit.licensePUBLISHER_POLICYen_US
mit.metadata.statusComplete


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