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dc.contributor.advisorJoseph M. Jacobson.en_US
dc.contributor.authorBulthaup, Colin A. (Colin Aaron), 1976-en_US
dc.contributor.otherMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Science.en_US
dc.date.accessioned2013-10-24T17:29:58Z
dc.date.available2013-10-24T17:29:58Z
dc.date.copyright2001en_US
dc.date.issued2001en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/81571
dc.descriptionThesis (M.Eng. and S.B.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2001.en_US
dc.descriptionIncludes bibliographical references (leaf 92).en_US
dc.description.statementofresponsibilityby Colin A. Bulthaup.en_US
dc.format.extent93 leavesen_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectElectrical Engineering and Computer Science.en_US
dc.titleLiquid embossing : a technique for fabricating sub-micron electrical, mechanical and biological structuresen_US
dc.title.alternativeFabricating sub-micron electrical, mechanical and biological structuresen_US
dc.typeThesisen_US
dc.description.degreeM.Eng.and S.B.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
dc.identifier.oclc51111279en_US


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