dc.contributor.advisor | Joseph M. Jacobson. | en_US |
dc.contributor.author | Bulthaup, Colin A. (Colin Aaron), 1976- | en_US |
dc.contributor.other | Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science. | en_US |
dc.date.accessioned | 2013-10-24T17:29:58Z | |
dc.date.available | 2013-10-24T17:29:58Z | |
dc.date.copyright | 2001 | en_US |
dc.date.issued | 2001 | en_US |
dc.identifier.uri | http://hdl.handle.net/1721.1/81571 | |
dc.description | Thesis (M.Eng. and S.B.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2001. | en_US |
dc.description | Includes bibliographical references (leaf 92). | en_US |
dc.description.statementofresponsibility | by Colin A. Bulthaup. | en_US |
dc.format.extent | 93 leaves | en_US |
dc.language.iso | eng | en_US |
dc.publisher | Massachusetts Institute of Technology | en_US |
dc.rights | M.I.T. theses are protected by
copyright. They may be viewed from this source for any purpose, but
reproduction or distribution in any format is prohibited without written
permission. See provided URL for inquiries about permission. | en_US |
dc.rights.uri | http://dspace.mit.edu/handle/1721.1/7582 | en_US |
dc.subject | Electrical Engineering and Computer Science. | en_US |
dc.title | Liquid embossing : a technique for fabricating sub-micron electrical, mechanical and biological structures | en_US |
dc.title.alternative | Fabricating sub-micron electrical, mechanical and biological structures | en_US |
dc.type | Thesis | en_US |
dc.description.degree | M.Eng.and S.B. | en_US |
dc.contributor.department | Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science | |
dc.identifier.oclc | 51111279 | en_US |