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dc.contributor.advisorStanley B. Gershwin.en_US
dc.contributor.authorMcCalib, David, Jren_US
dc.contributor.otherMassachusetts Institute of Technology. Department of Mechanical Engineering.en_US
dc.date.accessioned2014-03-19T15:45:32Z
dc.date.available2014-03-19T15:45:32Z
dc.date.copyright2013en_US
dc.date.issued2013en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/85790
dc.descriptionThesis: M. Eng. in Manufacturing, Massachusetts Institute of Technology, Department of Mechanical Engineering, 2013.en_US
dc.descriptionCataloged from PDF version of thesis.en_US
dc.descriptionIncludes bibliographical references (pages 52-54).en_US
dc.description.abstractThe failure rate of the printed circuit board electronic testing process is higher than acceptable at a Lenze Americas factory. This thesis will understand the root causes of failure, and use system engineering methods to decide what course of action should be taken. A Tradespace analysis is used to help decompose some of the complexity into a visualization that simplifies the decision process. The Tradespace analysis suggests that more utility can be achieved by upgrading the design of existing test fixtures versus purchasing off of the shelf solutions. The second phase will identify a design concept, offer specific design solutions, and finally a fully designed system that is capable of improving the performance of the test fixtures in electronic board test area by 50%. The system is then upgradable with in-line conveyors to run autonomously decoupling the operator from the process.en_US
dc.description.statementofresponsibilityby David McCalib, Jr.en_US
dc.format.extent54 pagesen_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectMechanical Engineering.en_US
dc.titleDesign method of a modular electronic printed circuit board testing systemen_US
dc.typeThesisen_US
dc.description.degreeM. Eng. in Manufacturingen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineering
dc.identifier.oclc871544352en_US


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