Particle generation in a chemical vapor deposition/plasma-enhanced chemical vapor deposition interlayer dielectric tool

Author(s)
Haberer, Elaine D. (Elaine Denise), 1975-
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Massachusetts Institute of Technology. Dept. of Materials Science and Engineering.
Advisor
L.C. Kimerling.
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Abstract
The interlayer dielectric plays an important role in multilevel integration. Material choice, processing, and contamination greatly impact the performance of the layer. In this study, particle generation, deposition, and adhesion mechanisms are reviewed. In particular, four important sources of interlayer dielectric particle contamination were investigated: the cleanroom environment, improper wafer handling, the backside of the wafer, and microarcing during process.
Description
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1998.
 
Includes bibliographical references (p. 77-79).
 
Date issued
1998
URI
http://hdl.handle.net/1721.1/8992
Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
Publisher
Massachusetts Institute of Technology
Keywords
Materials Science and Engineering.
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