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dc.contributor.advisorLionel C. Kimerling.en_US
dc.contributor.authorAhn, Sang Hoon, 1970-en_US
dc.contributor.otherMassachusetts Institute of Technology. Dept. of Materials Science and Engineering.en_US
dc.date.accessioned2005-08-22T22:58:22Z
dc.date.available2005-08-22T22:58:22Z
dc.date.copyright1999en_US
dc.date.issued1999en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/9130
dc.descriptionThesis (Ph.D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1999.en_US
dc.descriptionIncludes bibliographical references (leaves 108-111).en_US
dc.description.abstractJunction capacitance measurement is a well-established powerful characterization technique that allows one to explore electrical and physical properties of defects in bulk and interface of electronic materials. Capacitance-Voltage (CV) measures the overall net carrier concentration and a built-in voltage for a diode junction. Deep level transient spectroscopy (DLTS) as one of the most sensitive electrical measurement techniques can detect electrically active impurity concentration on the level of 10-1 to 10-5 of substrate doping concentration. The characteristic energy level and capture cross-section of the traps in the semiconductor energy gap can be extracted from DLTS temperature scans. Coupled with CV free carrier concentration profile, isothermal profiling by DLTS can determine the distribution of electrically active defects in the semiconductor. CV can also measure dielectric constant, K, on a metal-oxide-silicon structure. In this thesis, the junction capacitance technique is a primary tool used to study Er, Fe, and Mo in silicon. Si:5r is a candidate system for a light emitter in Si-based microphotonics. Fe is one of the most troublesome elements that degrade integrated circuit performance and solar cell efficiency. Mo is a fairly unknown contaminant typical of integrated circuit processing. Fluorosilicate glass is being used as a dielectric material for inter-metal levels in the current generation microprocessor. By measuring the reaction kinetics of the Er-related donor state, a defect structure for Si:Er light emitter center was deduced. The role of heterogeneous precipitation in Fe internal gettering was observed and modeled by measurement of residual [FeB] associates following [Fe] saturation, quench, and annealing processing. The diffusivity of Mo was determined and models for both the substitutional and the kick out diffusion mechanism were constructed. Finally, a predictive model for the F-content dependent dielectric constant variation of Si02 was established.en_US
dc.description.statementofresponsibilityby Sang Hoon Ahn.en_US
dc.format.extent111 leavesen_US
dc.format.extent7147150 bytes
dc.format.extent7146910 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypeapplication/pdf
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582
dc.subjectMaterials Science and Engineering.en_US
dc.titleElectrical studies of silicon and low K dielectric materialen_US
dc.typeThesisen_US
dc.description.degreePh.D.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineering
dc.identifier.oclc45232757en_US


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