MIT Libraries logoDSpace@MIT

MIT
View Item 
  • DSpace@MIT Home
  • MIT Libraries
  • MIT Theses
  • Graduate Theses
  • View Item
  • DSpace@MIT Home
  • MIT Libraries
  • MIT Theses
  • Graduate Theses
  • View Item
JavaScript is disabled for your browser. Some features of this site may not work without it.

Fabrication of chip-scale radio frequency inductors

Author(s)
Nation, Joshua C. (Joshua Caleb)
Thumbnail
DownloadFull printable version (2.190Mb)
Other Contributors
Massachusetts Institute of Technology. Department of Mechanical Engineering.
Advisor
Martin L. Culpepper.
Terms of use
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582
Metadata
Show full item record
Abstract
The purpose of this research was to learn the relationship between force and deformation in forming of micro-scale inductor coils. This was accomplished by applying large-deflection beam bending to the case of planar wire deformation and through experimental validation. Generating this knowledge is important because it establishes fabrication limits for wire-based chip-scale inductors. There are many potentially viable methods for fabricating planar inductor coils. Without an understanding of the relevant physics, it is impossible to know which of these techniques is most appropriate or even feasible. The analysis presented in this thesis directly led to the stencil-and-guide inductor fabrication concept, the details of which were specified using an analytic electrical model. The process utilizes a wire conductor, is compatible with any desired substrate, and features the ability to exactly control spiral properties. Multiple inductors were fabricated using this process. These inductors demonstrate performance specifications predicted by the model, including inductances ranging from 2 - 4 nH, quality factors in excess of 100, and self-resonant frequencies beyond 10 GHz. Furthermore, the area of the inductors is less than 1.5 mm2 and the entire device thickness is only 260 [mu]m. The inductors are most readily applied to increasingly small communication devices, which require thin and efficient electrical components to boost the performance of the radio frequency transceiver. Accordingly, these inductors offer the potential for substantial improvement in signal quality and reception.
Description
Thesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2014.
 
This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.
 
Cataloged from student-submitted PDF version of thesis.
 
Includes bibliographical references (pages 101-104).
 
Date issued
2014
URI
http://hdl.handle.net/1721.1/92067
Department
Massachusetts Institute of Technology. Department of Mechanical Engineering
Publisher
Massachusetts Institute of Technology
Keywords
Mechanical Engineering.

Collections
  • Graduate Theses

Browse

All of DSpaceCommunities & CollectionsBy Issue DateAuthorsTitlesSubjectsThis CollectionBy Issue DateAuthorsTitlesSubjects

My Account

Login

Statistics

OA StatisticsStatistics by CountryStatistics by Department
MIT Libraries
PrivacyPermissionsAccessibilityContact us
MIT
Content created by the MIT Libraries, CC BY-NC unless otherwise noted. Notify us about copyright concerns.