Electronic digital materials
Name
903903983-MIT.pdf
Description
Full printable version
Size
17.59 MB
Format
Adobe PDF
Checksum (MD5)
560f480e9c108c347fae1762500ad5d7
Author(s)
Langford, William Kai
Advisor(s)
Neil A. Gershenfeld.
Date Issued
2014
Publisher
Massachusetts Institute of Technology
Abstract
Digital materials are constructions assembled from a small number of types of discrete building blocks; they represent a new way of building functional, multi-material, three-dimensional structures. In this thesis, I focus on the construction of microelectronics from vertically assemble-able two-dimensional parts. With just a conducting and insulating part-type, I show that it is possible to make discretely assembled electrical networks. With a third resistive part-type, I show that it is possible to make any passive electronic component and complex impedance circuitry, including antennas and matching networks. Finally, with four semiconducting part-types I suggest that it is possible to assemble active components like diodes and transistors. This work details the part production processes to create two-dimensional micro-bricks, modeling and assembly strategies to create functional structures from discrete parts, the measurement and evaluation of the bulk properties of the assemblies, and experiments in assembly automation.
Description
Thesis: S.M., Massachusetts Institute of Technology, School of Architecture and Planning, Program in Media Arts and Sciences, 2014.
Cataloged from PDF version of thesis.
Includes bibliographical references (pages 107-109).
Subjects
Architecture. Program in Media Arts and Sciences.
MIT Department
Program in Media Arts and Sciences (Massachusetts Institute of Technology)
Terms of Use
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
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