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Author(s)
Langford, William Kai
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Massachusetts Institute of Technology. Department of Architecture. Program in Media Arts and Sciences.
Advisor
Neil A. Gershenfeld.
Terms of use
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582
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Abstract
Digital materials are constructions assembled from a small number of types of discrete building blocks; they represent a new way of building functional, multi-material, three-dimensional structures. In this thesis, I focus on the construction of microelectronics from vertically assemble-able two-dimensional parts. With just a conducting and insulating part-type, I show that it is possible to make discretely assembled electrical networks. With a third resistive part-type, I show that it is possible to make any passive electronic component and complex impedance circuitry, including antennas and matching networks. Finally, with four semiconducting part-types I suggest that it is possible to assemble active components like diodes and transistors. This work details the part production processes to create two-dimensional micro-bricks, modeling and assembly strategies to create functional structures from discrete parts, the measurement and evaluation of the bulk properties of the assemblies, and experiments in assembly automation.
Description
Thesis: S.M., Massachusetts Institute of Technology, School of Architecture and Planning, Program in Media Arts and Sciences, 2014.
 
Cataloged from PDF version of thesis.
 
Includes bibliographical references (pages 107-109).
 
Date issued
2014
URI
http://hdl.handle.net/1721.1/95609
Department
Program in Media Arts and Sciences (Massachusetts Institute of Technology)
Publisher
Massachusetts Institute of Technology
Keywords
Architecture. Program in Media Arts and Sciences.

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