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Materials selection and processing for reliable neural interfaces

Author(s)
Tringides, Christina M. (Christina Myra)
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Massachusetts Institute of Technology. Department of Materials Science and Engineering.
Advisor
Polina Anikeeva.
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M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582
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Abstract
The understanding of the brain would be revolutionized by a tool that can measure intra- and extra-cellular electrical potentials on a parallelized scale, without disrupting the neural physiology. Existing technologies do not sufficiently carry out these functions. Using a thermal drawing process (TDP), multimaterial fibers comprised of polymer-metal composites can be fabricated to create flexible, microelectrode arrays. These fibers can be further processed after the TDP, using selective etching to reduce the diameter of the probe. These devices have been implanted and have been used to record neural activity in vivo while evoking minimal tissue response. Additionally, electrodeposition of biocompatible metals onto the fiber-electrode tips can be implemented to increase the signal-to-noise ratio (SNR). Here, I describe the electroplating of gold onto the fiber-tips of tin and tin-indium electrodes, which were drawn using TDP. By adjusting the electrodeposition conditions, the electrode tip geometries can be tuned to optimize the interface between the device tips and neuronal membranes.
Description
Thesis: S.B., Massachusetts Institute of Technology, Department of Materials Science and Engineering, 2015.
 
Cataloged from PDF version of thesis.
 
Includes bibliographical references (pages 48-50).
 
Date issued
2015
URI
http://hdl.handle.net/1721.1/98667
Department
Massachusetts Institute of Technology. Department of Materials Science and Engineering
Publisher
Massachusetts Institute of Technology
Keywords
Materials Science and Engineering.

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