Modeling and design of perforated prosthetic sockets ARCHM to increase heat transfer of residual limbs
Author(s)
Carbajal, Luis
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Other Contributors
Massachusetts Institute of Technology. Department of Mechanical Engineering.
Advisor
Timothy Gutowski.
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Heat build-up in prosthetic sockets is a significant problem experienced by many amputees in America, with no central solution in sight. Heat and discomfort accounts for over 70% of problems experienced by lower limb amputees in America. Although there have been advances in prosthetics in the active-power knees and ankles, not even cybernetics can improve the comfort of the prosthesis if there is still a socket. The materials in prosthetic sockets are not conductive enough to relieve the heat inside of the socket. The purpose of this study is to model the temperature variance and heat transfer of an amputee's residual limb and design ways to improve current prosthetic socket technologies. With the addition of small holes, or perforations, in the socket, there will be an increase in the heat transfer by convection, while still maintaining the strength of a carbon fiber prosthesis. Through the use of discrete approximation modeling, the transient temperature inside of the socket layers can be identified and improved through design patterns cut into the socket. Increased heat transfer can be observed as the perforations in the socket become larger, although the larger the holes, the larger the stresses are in the prosthesis. Non-intrusive designs were developed for sockets before and after they are made to increase convection surface area. More modeling needs to be done in 3-dimensional polar coordinates.
Description
Thesis: S.B., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2015. Cataloged from PDF version of thesis. Includes bibliographical references (page 18).
Date issued
2015Department
Massachusetts Institute of Technology. Department of Mechanical EngineeringPublisher
Massachusetts Institute of Technology
Keywords
Mechanical Engineering.