Slurry abrasive particle agglomeration experimentation and modeling for chemical mechanical planarization (CMP)
Name
927405078-MIT.pdf
Description
Full printable version
Size
28.45 MB
Format
Adobe PDF
Checksum (MD5)
81f666f8e3e31326293cd0667d692019
Author(s)
Johnson, Joy Marie
Advisor(s)
Duane S. Boning.
Date Issued
2015
Publisher
Massachusetts Institute of Technology
Abstract
A theoretical modeling approach is developed to predict silica-specific instability in chemical-mechanical polishing (CMP) slurries. In CMP, the formation of large agglomerates is of great concern, as these large particles are associated with high defectivity and poor polishing performance. The proposed model describes the complex CMP slurry system as a colloid under high non-linear shear conditions. The model diverges from the classic colloidal models by focusing on the following: reaction limited agglomeration (RLA) bounded by silica-specific modes of transitory bonding, and modified DVLO assumptions to include chemical activation and hydrodynamic agglomerate break-up condition evaluation. In order to build physical intuition and predict key model parameters, fundamental studies and novel metrology of agglomerates is performed.
Description
Thesis: Ph. D., Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 2015.
Cataloged from PDF version of thesis.
Includes bibliographical references (pages 177-188).
Subjects
Electrical Engineering and Computer Science.
MIT Department
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
Terms of Use
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