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Jeffrey H. Lang and David L. Trumper. Kumar, Rakesh, Ph. D. Massachusetts Institute of Technology Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science. Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science 2017-03-10T14:20:12Z 2017-03-10T14:20:12Z 2016 2016 http://hdl.handle.net/1721.1/107294 973724936 Thesis: S.M., Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 2016. This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections. Cataloged from student-submitted PDF version of thesis. Includes bibliographical references (pages 107-109). Contact-less, three-dimensional scanning is a highly important field for the semiconductor industry. By using a system of high-bandwidth impedance sensors and drive electronics, the physical constituents of ICs such as buried/surface dielectrics, buried/surface conductors and PN junctions could be detected. This thesis takes an initial step toward high-bandwidth electroquasistatic (EQS) imaging by exploring the use of high-frequency imaging. When combined with impedance sensors having a high spatial density, it could be possible to develop a very-high-bandwidth scanning imaging system. The system explored here uses a capacitively-coupled electrode array in order to distinguish various features such as a dielectric layer or a variable air gap based on measured electrode impedance. The frequency at which the impedance is measured is near 500 MHz. Also, this system can be potentially used to image depth information and dielectric composition by using multi-wavelength electrode arrays. This thesis presents the selection and layout for the high-speed drive electronics and the construction and modeling of the driven electrode arrays. Validation experiments to illustrate capacitive sensing ability are also performed. The system is able to identify surface topography, distinguish surface dielectrics from metals, and discern changes in bulk conductivity. by Rakesh Kumar. S.M. 109 pages eng Massachusetts Institute of Technology MIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission. http://dspace.mit.edu/handle/1721.1/7582 Electrical Engineering and Computer Science. Towards high-bandwidth scanning impedance imaging Thesis application/pdf false Publication unknown unknown <Publication xmlns="https://www.openaire.eu/cerif-profile/1.1/" id="068da7af-8be2-4056-b233-506b71e277d9"> <Type xmlns="https://www.openaire.eu/cerif-profile/vocab/COAR_Publication_Types">http://purl.org/coar/resource_type/c_1843</Type> <Language>eng</Language> <Title>Towards high-bandwidth scanning impedance imaging</Title> <PublishedIn> <Publication> </Publication> </PublishedIn> <PublicationDate>2016</PublicationDate> <Authors> <Author> <DisplayName>Kumar, Rakesh, Ph. D. Massachusetts Institute of Technology</DisplayName> <Affiliation> <OrgUnit> </OrgUnit> </Affiliation> </Author> </Authors> <Editors> </Editors> <Publishers> <Publisher> <DisplayName>Massachusetts Institute of Technology</DisplayName> <OrgUnit /> </Publisher> </Publishers> <License>http://dspace.mit.edu/handle/1721.1/7582</License> <Keyword>Electrical Engineering and Computer Science.</Keyword> <Abstract>Contact-less, three-dimensional scanning is a highly important field for the semiconductor industry. By using a system of high-bandwidth impedance sensors and drive electronics, the physical constituents of ICs such as buried/surface dielectrics, buried/surface conductors and PN junctions could be detected. This thesis takes an initial step toward high-bandwidth electroquasistatic (EQS) imaging by exploring the use of high-frequency imaging. When combined with impedance sensors having a high spatial density, it could be possible to develop a very-high-bandwidth scanning imaging system. The system explored here uses a capacitively-coupled electrode array in order to distinguish various features such as a dielectric layer or a variable air gap based on measured electrode impedance. The frequency at which the impedance is measured is near 500 MHz. Also, this system can be potentially used to image depth information and dielectric composition by using multi-wavelength electrode arrays. This thesis presents the selection and layout for the high-speed drive electronics and the construction and modeling of the driven electrode arrays. Validation experiments to illustrate capacitive sensing ability are also performed. The system is able to identify surface topography, distinguish surface dielectrics from metals, and discern changes in bulk conductivity.</Abstract> <Access xmlns="http://purl.org/coar/access_right" > </Access> </Publication>