2026-09-19T06:53:59Zhttps://dspace.mit.edu/server/oai/requestoai:dspace.mit.edu:1721.1/114462022-01-13T07:54:32Zcom_1721.1_7582com_1721.1_7581col_1721.1_131022
Carl V. Thompson.
Joo, Young-Chang
Massachusetts Institute of Technology. Department of Materials Science and Engineering
2005-08-17T18:38:43Z
2005-08-17T18:38:43Z
1995
1995
http://hdl.handle.net/1721.1/11446
33328012
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1995.
Includes bibliographical references (leaves 206-216).
by Young-Chang Joo.
Ph.D.
216 leaves
12636318 bytes
12636077 bytes
application/pdf
application/pdf
eng
Massachusetts Institute of Technology
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http://dspace.mit.edu/handle/1721.1/7582
Materials Science and Engineering
Electromigration failure and reliability of single-crystal and polycyrstalline aluminum interconnects for integrated circuits
Thesis
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