<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-19T06:30:50Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/118038" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/118038</identifier><datestamp>2026-06-16T18:53:18Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131022</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Lionel C. Kimerling.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Yu, Wei, Ph. D. Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Department of Materials Science and Engineering.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Massachusetts Institute of Technology. Department of Materials Science and Engineering</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2018-09-17T15:54:51Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="available">2018-09-17T15:54:51Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2018</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2018</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="uri">http://hdl.handle.net/1721.1/118038</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">1051459050</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis: Ph. D., Massachusetts Institute of Technology, Department of Materials Science and Engineering, 2018.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Cataloged from PDF version of thesis.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">The evolution of data center network interconnects is based: at the component level, on cost, power, and bandwidth density; and at the system level, on cost, unit count, footprint, and implementation time. The decision for iterative vs. transformational design depends critically on the product horizon view that amortizes R&amp;D, manufacture tooling and infrastructure preparation. An iterative platform can be implemented earlier, but it may present limited performance scalability. A transformational design can have large creation and implementation costs that are amortized over a longer time window. A framework for quantitatively capturing these variables using a new technology inventory model is developed. Scenarios for deployment of six different transceiver package platforms to meet the projected data center capacity scaling ramp are constructed. The iterative designs provide better return on investment for a 3-year time window, while the transformational designs are optimized for a 20-year window.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Wei Yu.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">Ph.D.</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">121 pages</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">MIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission.</dim:field>
   <dim:field mdschema="dc" element="rights" qualifier="uri" lang="en_US">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Materials Science and Engineering.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Techno-economical evaluation of intra-datacenter optical transceiver designs</dim:field>
   <dim:field mdschema="dc" element="type" lang="en_US">Thesis</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="mimetype">application/pdf</dim:field>
   <dim:field mdschema="dspace" element="authorsordered">false</dim:field>
   <dim:field mdschema="dspace" element="entity" qualifier="type">Publication</dim:field>
   <dim:field mdschema="others" element="access-status">unknown</dim:field>
   <dim:field mdschema="others" element="access-status">unknown</dim:field>
   <dim:field mdschema="cerif" element="openaire" authority="" confidence="-1">&lt;Publication xmlns="https://www.openaire.eu/cerif-profile/1.1/" id="22bf9217-7551-43d4-ae71-db1e1976bb35">
	&lt;Type xmlns="https://www.openaire.eu/cerif-profile/vocab/COAR_Publication_Types">http://purl.org/coar/resource_type/c_1843&lt;/Type>
	&lt;Language>eng&lt;/Language>
   	&lt;Title>Techno-economical evaluation of intra-datacenter optical transceiver designs&lt;/Title>
   	&lt;PublishedIn>
    	&lt;Publication>
      	&lt;/Publication>
   	&lt;/PublishedIn>
   	&lt;PublicationDate>2018&lt;/PublicationDate>
   	&lt;Authors>
      	&lt;Author>
        	&lt;DisplayName>Yu, Wei, Ph. D. Massachusetts Institute of Technology&lt;/DisplayName>
         	&lt;Affiliation>
         		&lt;OrgUnit>
         		&lt;/OrgUnit>
         	&lt;/Affiliation>
      	&lt;/Author>
	&lt;/Authors>
   	&lt;Editors>
	&lt;/Editors>
    &lt;Publishers>
        &lt;Publisher>
            &lt;DisplayName>Massachusetts Institute of Technology&lt;/DisplayName>
            &lt;OrgUnit />
        &lt;/Publisher>
    &lt;/Publishers>
    &lt;License>http://dspace.mit.edu/handle/1721.1/7582&lt;/License>
    &lt;Keyword>Materials Science and Engineering.&lt;/Keyword>
   	&lt;Abstract>The evolution of data center network interconnects is based: at the component level, on cost, power, and bandwidth density; and at the system level, on cost, unit count, footprint, and implementation time. The decision for iterative vs. transformational design depends critically on the product horizon view that amortizes R&amp;amp;D, manufacture tooling and infrastructure preparation. An iterative platform can be implemented earlier, but it may present limited performance scalability. A transformational design can have large creation and implementation costs that are amortized over a longer time window. A framework for quantitatively capturing these variables using a new technology inventory model is developed. Scenarios for deployment of six different transceiver package platforms to meet the projected data center capacity scaling ramp are constructed. The iterative designs provide better return on investment for a 3-year time window, while the transformational designs are optimized for a 20-year window.&lt;/Abstract>
	&lt;Access xmlns="http://purl.org/coar/access_right" 
    >
    &lt;/Access>
&lt;/Publication>
</dim:field>
</dim:dim>
</metadata></record></GetRecord></OAI-PMH>