<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-19T21:19:02Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/122732" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/122732</identifier><datestamp>2021-07-05T14:03:20Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131023</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Stefanie Mueller.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Zhu, Junyi,S.M.Massachusetts Institute of Technology.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department" lang="en_US">Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2019-11-04T20:21:33Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="available">2019-11-04T20:21:33Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2019</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2019</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="uri">https://hdl.handle.net/1721.1/122732</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">1124679434</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis: S.M. in Computer Science and Engineering, Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 2019</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Cataloged from PDF version of thesis.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (pages 44-46).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">3D breadboards are a new form of physical prototypes with breadboard functions directly integrated into its surfaces. 3D breadboards offer both the flexibility and re-configurability of breadboards, while also integrating well with the shape of the prototype. As a result, 3D breadboards can be used to test function directly in context of the actual physical form. Our custom 3D editor plugin supports designers in the process of converting 3D models into 3D breadboards. Our plugin first generates a pinhole pattern on the surface of the 3D model; designers can then connect the holes into power lines and terminal strips depending on the desired layout. To fabricate the 3D breadboards, designers only have to 3D print the housing and then fill the wire channels with conductive silicone. We explore a number of computational design and computer graphics approaches to convert arbitrary 3D models into 3D breadboards. We demonstrate a range of different interactive prototypes designed by our software system, and report on a user study with six participants to validate the concept of integrating breadboards into physical prototypes.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Junyi Zhu.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">S.M. in Computer Science and Engineering</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="collection" lang="en_US">S.M.inComputerScienceandEngineering Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">46 pages</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">MIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission.</dim:field>
   <dim:field mdschema="dc" element="rights" qualifier="uri" lang="en_US">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Electrical Engineering and Computer Science.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">A software pipeline for converting 3D models into 3D breadboards</dim:field>
   <dim:field mdschema="dc" element="title" qualifier="alternative" lang="en_US">Software pipeline for converting three-dimensional models into three-dimensional breadboards</dim:field>
   <dim:field mdschema="dc" element="type" lang="en_US">Thesis</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="mimetype">application/pdf</dim:field>
   <dim:field mdschema="dspace" element="imported" lang="en_US">2019-11-04T20:21:32Z</dim:field>
   <dim:field mdschema="dspace" element="entity" qualifier="type">Publication</dim:field>
   <dim:field mdschema="mit" element="thesis" qualifier="degree" lang="en_US">Master</dim:field>
   <dim:field mdschema="mit" element="thesis" qualifier="department" lang="en_US">EECS</dim:field>
   <dim:field mdschema="others" element="access-status">unknown</dim:field>
   <dim:field mdschema="others" element="access-status">unknown</dim:field>
   <dim:field mdschema="cerif" element="openaire" authority="" confidence="-1">&lt;Publication xmlns="https://www.openaire.eu/cerif-profile/1.1/" id="27e60065-a2ae-4577-a4fc-37872c027986">
	&lt;Type xmlns="https://www.openaire.eu/cerif-profile/vocab/COAR_Publication_Types">http://purl.org/coar/resource_type/c_1843&lt;/Type>
	&lt;Language>eng&lt;/Language>
   	&lt;Title>A software pipeline for converting 3D models into 3D breadboards&lt;/Title>
   	&lt;Subtitle>Software pipeline for converting three-dimensional models into three-dimensional breadboards&lt;/Subtitle>
   	&lt;PublishedIn>
    	&lt;Publication>
      	&lt;/Publication>
   	&lt;/PublishedIn>
   	&lt;PublicationDate>2019&lt;/PublicationDate>
   	&lt;Authors>
      	&lt;Author>
        	&lt;DisplayName>Zhu, Junyi,S.M.Massachusetts Institute of Technology.&lt;/DisplayName>
         	&lt;Affiliation>
         		&lt;OrgUnit>
         		&lt;/OrgUnit>
         	&lt;/Affiliation>
      	&lt;/Author>
	&lt;/Authors>
   	&lt;Editors>
	&lt;/Editors>
    &lt;Publishers>
        &lt;Publisher>
            &lt;DisplayName>Massachusetts Institute of Technology&lt;/DisplayName>
            &lt;OrgUnit />
        &lt;/Publisher>
    &lt;/Publishers>
    &lt;License>http://dspace.mit.edu/handle/1721.1/7582&lt;/License>
    &lt;Keyword>Electrical Engineering and Computer Science.&lt;/Keyword>
   	&lt;Abstract>3D breadboards are a new form of physical prototypes with breadboard functions directly integrated into its surfaces. 3D breadboards offer both the flexibility and re-configurability of breadboards, while also integrating well with the shape of the prototype. As a result, 3D breadboards can be used to test function directly in context of the actual physical form. Our custom 3D editor plugin supports designers in the process of converting 3D models into 3D breadboards. Our plugin first generates a pinhole pattern on the surface of the 3D model; designers can then connect the holes into power lines and terminal strips depending on the desired layout. To fabricate the 3D breadboards, designers only have to 3D print the housing and then fill the wire channels with conductive silicone. We explore a number of computational design and computer graphics approaches to convert arbitrary 3D models into 3D breadboards. We demonstrate a range of different interactive prototypes designed by our software system, and report on a user study with six participants to validate the concept of integrating breadboards into physical prototypes.&lt;/Abstract>
	&lt;Access xmlns="http://purl.org/coar/access_right" 
    >
    &lt;/Access>
&lt;/Publication>
</dim:field>
</dim:dim>
</metadata></record></GetRecord></OAI-PMH>