<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-20T19:45:39Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/123005" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/123005</identifier><datestamp>2026-06-06T00:55:11Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131023</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Stefanie Mueller.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Blumberg, LottaGili(LottaGili G.)</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department" lang="en_US">Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2019-11-22T00:01:39Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="available">2019-11-22T00:01:39Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2019</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="uri">https://hdl.handle.net/1721.1/123005</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">1127391639</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis: M. Eng., Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 2019</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Cataloged from student-submitted PDF version of thesis. "June 2019."</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (pages 53-55).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">CurveBoards are 3D breadboards integrated into the surface of physical prototypes. CurveBoards offer both the flexibility of breadboards, i.e., the ability to add or remove components, while also integrating well with the shape of the prototype. Thus, designers can use CurveBoards to test function directly in context of the actual physical form. We demonstrate our method for fabricating the CurveBoard in which designers only have to 3D print the housing and then fill the wire channels with conductive silicone. We also discuss limitations to this approach and alternative fabrication methods. We display a range of different application scenarios and report on a user study with six participants that showed that prototypes created as CurveBoards looked and felt closer to the final design.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by LottaGili Blumberg.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">M.Eng.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="collection" lang="en_US">M.Eng. Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">55 pages</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">MIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission.</dim:field>
   <dim:field mdschema="dc" element="rights" qualifier="uri" lang="en_US">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Electrical Engineering and Computer Science.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Exploring fabrication principles for making freeform breadBoards</dim:field>
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   	&lt;Title>Exploring fabrication principles for making freeform breadBoards&lt;/Title>
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   	&lt;PublicationDate>2019&lt;/PublicationDate>
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    &lt;Keyword>Electrical Engineering and Computer Science.&lt;/Keyword&gt;
   	&lt;Abstract>CurveBoards are 3D breadboards integrated into the surface of physical prototypes. CurveBoards offer both the flexibility of breadboards, i.e., the ability to add or remove components, while also integrating well with the shape of the prototype. Thus, designers can use CurveBoards to test function directly in context of the actual physical form. We demonstrate our method for fabricating the CurveBoard in which designers only have to 3D print the housing and then fill the wire channels with conductive silicone. We also discuss limitations to this approach and alternative fabrication methods. We display a range of different application scenarios and report on a user study with six participants that showed that prototypes created as CurveBoards looked and felt closer to the final design.&lt;/Abstract>
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