<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-20T13:36:39Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/123077" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/123077</identifier><datestamp>2026-06-06T00:54:53Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131023</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Joe Steinmeyer.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Phan, Tuan M.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department" lang="en_US">Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2019-11-22T00:10:20Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="available">2019-11-22T00:10:20Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2019</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2019</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="uri">https://hdl.handle.net/1721.1/123077</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">1127827323</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis: M. Eng., Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 2019</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Cataloged from PDF version of thesis.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (page 39).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">The automated micromanipulator, a device widely used in the life sciences, allows precise three-dimensional positioning of tools and equipment with resolutions at or well below one micrometer, providing cellular-level movement resolution in a highly-controlled manner. The cost of a state-of-the- art electromechanical micromanipulator can be upwards of ten thousand dollars for a complete system, and can be a major, if not limiting, expense for labs, startups, and even hobbyists in these fields. The objective of this project is to build a proof-of-concept micromanipulation device that provides similar levels of performance, but at a price in the range of several hundred dollars. We intend to achieve this by utilizing equipment made recently and inexpensively available at low-costs because of the hobbyist 3D-printing market, as well as advances in piezoelectrics and imaging technologies from the last five years. By accomplishing this, the barrier of entry for work requiring sub-micron measurement will be lowered significantly.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Tuan M. Phan.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">M.Eng.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="collection" lang="en_US">M.Eng. Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">39 pages</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">MIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission.</dim:field>
   <dim:field mdschema="dc" element="rights" qualifier="uri" lang="en_US">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Electrical Engineering and Computer Science.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">A low-cost automated micromanipulator</dim:field>
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   	&lt;Title>A low-cost automated micromanipulator&lt;/Title>
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   	&lt;PublicationDate>2019&lt;/PublicationDate>
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        	&lt;DisplayName>Phan, Tuan M.&lt;/DisplayName>
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    &lt;Keyword>Electrical Engineering and Computer Science.&lt;/Keyword>
   	&lt;Abstract>The automated micromanipulator, a device widely used in the life sciences, allows precise three-dimensional positioning of tools and equipment with resolutions at or well below one micrometer, providing cellular-level movement resolution in a highly-controlled manner. The cost of a state-of-the- art electromechanical micromanipulator can be upwards of ten thousand dollars for a complete system, and can be a major, if not limiting, expense for labs, startups, and even hobbyists in these fields. The objective of this project is to build a proof-of-concept micromanipulation device that provides similar levels of performance, but at a price in the range of several hundred dollars. We intend to achieve this by utilizing equipment made recently and inexpensively available at low-costs because of the hobbyist 3D-printing market, as well as advances in piezoelectrics and imaging technologies from the last five years. By accomplishing this, the barrier of entry for work requiring sub-micron measurement will be lowered significantly.&lt;/Abstract>
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