2026-09-21T16:42:43Zhttps://dspace.mit.edu/server/oai/requestoai:dspace.mit.edu:1721.1/123932022-01-13T07:54:29Zcom_1721.1_7582com_1721.1_7581col_1721.1_131023
Lionel C. Kimerling and Steven D. Eppinger.
Smith, Gregory J. (Gregory John)
Sloan School of Management
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
2005-08-15T23:17:47Z
2005-08-15T23:17:47Z
1993
1993
http://hdl.handle.net/1721.1/12393
29329792
Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management, 1993, and Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1993.
Includes bibliographical references (p. 207-209).
by Gregory J. Smith.
M.S.
209 p.
14325829 bytes
14325588 bytes
application/pdf
application/pdf
eng
Massachusetts Institute of Technology
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
http://dspace.mit.edu/handle/1721.1/7582
Sloan School of Management
Electrical Engineering and Computer Science
Managing process development risk : aluminum ultrasonic wire bonding for chip-on-board applications
Thesis
application/pdf
Publication
unknown
unknown
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