<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-19T00:53:48Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/132913" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/132913</identifier><datestamp>2025-10-30T15:50:03Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131024</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor">Christopher A. Schuh.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Payne, Madelyn
            (Madelyn I.)</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Department of Materials Science and Engineering.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department" lang="en_US">Massachusetts Institute of Technology. Department of Materials Science and Engineering</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2021-10-08T18:28:37Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="available">2021-10-08T18:28:37Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2019</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2019</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="uri">https://hdl.handle.net/1721.1/132913</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">1263579538</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis: S.B., Massachusetts Institute of Technology, Department of Materials Science and Engineering, June, 2019</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Cataloged from the official PDF version of thesis.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (pages 47-49).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">Shape-memory alloys (SMAs) are a class of materials that can recover from apparent permanent strain (on the order of 5%) due to a solid-to-solid phase transformation. It has been recently suggested that SMAs satisfying a set of so-called cofactor conditions possess perfect interface compatibility and additional microstructural flexibility during transformation, which are theorized to result in excellent reversibility. Cu-based SMAs are cheaper than other alternatives, but polycrystalline Cu-based SMAs are unable to withstand many cycles because they are prone to cracking and degradation of functional properties. Previous research has identied improved shape-memory properties in Cu-Al-Ni-Mn SMAs in the oligocrystalline state, but polycrystalline material of the same composition has yet to be characterized. In this thesis, I characterize the compatibility of Cu-Al-Ni-Mn alloys according to the cofactor conditions and correlate these findings with results from superelastic mechanical cycling. Building on this knowledge, I also present a new alloy design that is predicted to meet the cofactor conditions and provides a promising path forward for a functionally stable, low-cost, polycrystalline Cu-based SMA.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Madelyn Payne.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">S.B.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="collection" lang="en_US">S.B. Massachusetts Institute of Technology, Department of Materials Science and Engineering</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">49 pages</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">MIT theses may be protected by copyright. Please reuse MIT thesis content according to the MIT Libraries Permissions Policy, which is available through the URL provided.</dim:field>
   <dim:field mdschema="dc" element="rights" qualifier="uri" lang="en_US">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Materials Science and Engineering.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Exploring crystallographic compatibility in polycrystalline Cu-based shape-memory alloys</dim:field>
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   <dim:field mdschema="mit" element="thesis" qualifier="department" lang="en_US">MatSci</dim:field>
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   	&lt;Title>Exploring crystallographic compatibility in polycrystalline Cu-based shape-memory alloys&lt;/Title>
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   	&lt;Abstract>Shape-memory alloys (SMAs) are a class of materials that can recover from apparent permanent strain (on the order of 5%) due to a solid-to-solid phase transformation. It has been recently suggested that SMAs satisfying a set of so-called cofactor conditions possess perfect interface compatibility and additional microstructural flexibility during transformation, which are theorized to result in excellent reversibility. Cu-based SMAs are cheaper than other alternatives, but polycrystalline Cu-based SMAs are unable to withstand many cycles because they are prone to cracking and degradation of functional properties. Previous research has identied improved shape-memory properties in Cu-Al-Ni-Mn SMAs in the oligocrystalline state, but polycrystalline material of the same composition has yet to be characterized. In this thesis, I characterize the compatibility of Cu-Al-Ni-Mn alloys according to the cofactor conditions and correlate these findings with results from superelastic mechanical cycling. Building on this knowledge, I also present a new alloy design that is predicted to meet the cofactor conditions and provides a promising path forward for a functionally stable, low-cost, polycrystalline Cu-based SMA.&lt;/Abstract>
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