2026-09-20T15:23:22Zhttps://dspace.mit.edu/server/oai/requestoai:dspace.mit.edu:1721.1/134342022-01-13T07:54:29Zcom_1721.1_7582com_1721.1_7581col_1721.1_131023
Martin A. Schmidt.
Ng, Kay-Yip
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
2005-09-21T22:20:03Z
2005-09-21T22:20:03Z
1990
1990
http://hdl.handle.net/1721.1/13434
25615925
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1990.
Includes bibliographical references (leaves 131-135).
by Kay-Yip Ng.
M.S.
135 leaves
8102906 bytes
8102667 bytes
application/pdf
application/pdf
eng
Massachusetts Institute of Technology
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
http://dspace.mit.edu/handle/1721.1/7582
Electrical Engineering and Computer Science
A liquid-shear-stress sensor using wafer-bonding technology
Thesis
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