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   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Carl V. Thompson.</dim:field>
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   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1990.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (leaves 210-222).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Jaeshin Cho.</dim:field>
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   <dim:field mdschema="dc" element="title" lang="en_US">Effect of microstructure of aluminum alloys on the electromigration-limited reliability of VLSI interconnects</dim:field>
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   	&lt;Title>Effect of microstructure of aluminum alloys on the electromigration-limited reliability of VLSI interconnects&lt;/Title>
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