2026-09-21T21:29:41Zhttps://dspace.mit.edu/server/oai/requestoai:dspace.mit.edu:1721.1/140202022-01-13T07:54:33Zcom_1721.1_7582com_1721.1_7581col_1721.1_131022
Joel P. Clark.
Ng, Lee Hong
Massachusetts Institute of Technology. Dept. of Materials Science and Engineering.
Massachusetts Institute of Technology. Department of Materials Science and Engineering
2005-08-10T19:07:21Z
2005-08-10T19:07:21Z
1990
1990
http://hdl.handle.net/1721.1/14020
23248703
Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1990.
Includes bibliographical references (leaves 190-194).
by Ng, Lee Hong.
Ph.D.
194 leaves
13326077 bytes
13325834 bytes
application/pdf
application/pdf
eng
Massachusetts Institute of Technology
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
http://dspace.mit.edu/handle/1721.1/7582
Materials Science and Engineering.
Printed circuit board materials : an evaluation of manufacturing technologies and market requirements
Thesis
application/pdf
false
Publication
unknown
unknown
<Publication xmlns="https://www.openaire.eu/cerif-profile/1.1/" id="00c7e6e4-ce1b-416d-b49a-7169f814acfa">
<Type xmlns="https://www.openaire.eu/cerif-profile/vocab/COAR_Publication_Types">http://purl.org/coar/resource_type/c_1843</Type>
<Language>eng</Language>
<Title>Printed circuit board materials : an evaluation of manufacturing technologies and market requirements</Title>
<PublishedIn>
<Publication>
</Publication>
</PublishedIn>
<PublicationDate>1990</PublicationDate>
<Authors>
<Author>
<DisplayName>Ng, Lee Hong</DisplayName>
<Affiliation>
<OrgUnit>
</OrgUnit>
</Affiliation>
</Author>
</Authors>
<Editors>
</Editors>
<Publishers>
<Publisher>
<DisplayName>Massachusetts Institute of Technology</DisplayName>
<OrgUnit />
</Publisher>
</Publishers>
<License>http://dspace.mit.edu/handle/1721.1/7582</License>
<Keyword>Materials Science and Engineering.</Keyword>
<Access xmlns="http://purl.org/coar/access_right"
>
</Access>
</Publication>