2026-09-20T04:24:22Zhttps://dspace.mit.edu/server/oai/requestoai:dspace.mit.edu:1721.1/150702022-01-13T07:54:36Zcom_1721.1_7582com_1721.1_7581col_1721.1_131023
Lallit Anand.
Adams, Pamela Joan
Massachusetts Institute of Technology. Dept. of Mechanical Engineering.
Massachusetts Institute of Technology. Department of Mechanical Engineering
2005-08-08T17:12:54Z
2005-08-08T17:12:54Z
1986
1986
http://hdl.handle.net/1721.1/15070
15625969
Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1986.
MICROFICHE COPY AVAILABLE IN ARCHIVES AND ENGINEERING
Bibliography: leaves 48-52.
by Pamela Joan Adams.
M.S.
142 leaves
8502861 bytes
8502620 bytes
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eng
Massachusetts Institute of Technology
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
http://dspace.mit.edu/handle/1721.1/7582
Mechanical Engineering.
Thermal fatigue of solder joints in micro-electronic devices
Thesis
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