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   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Dr. Jung-Hoon Chun.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Rocha Alvarez, Juan Carlos, 1971-</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Dept. of Mechanical Engineering.</dim:field>
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   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">1997</dim:field>
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   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 1997.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (leaves 78-79).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Juan Carlos Rocha Alvarez.</dim:field>
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   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
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   <dim:field mdschema="dc" element="subject" lang="en_US">Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Control of the UDS process for the production of solder balls for BGA electronics packaging</dim:field>
   <dim:field mdschema="dc" element="title" qualifier="alternative" lang="en_US">Control of the Uniform Droplet Spray process for the production of solder balls for Ball Grid Array electronics packaging</dim:field>
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   	&lt;Title>Control of the UDS process for the production of solder balls for BGA electronics packaging&lt;/Title>
   	&lt;Subtitle>Control of the Uniform Droplet Spray process for the production of solder balls for Ball Grid Array electronics packaging&lt;/Subtitle>
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