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   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Jacob K. White.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Vithayathil, Anne M. (Anne Marie), 1978-</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2005-09-27T16:54:51Z</dim:field>
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   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2004</dim:field>
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   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2004.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (p. 65-66).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">In recent years, mixed-signal designs have become more pervasive, due to their efficient use of area and power. Unfortunately, with sensitive analog and fast digital circuits sharing a common, non-ideal substrate, such designs carry the additional design burden of electromagnetic coupling between contacts. This thesis presents a method that quickly extracts the electroquasistatic coupling resistances between contacts on a planar, rectangular, two-layer lossy substrate, using an FFT-accelerated multi-domain surface integral formulation. The multi-domain surface integral formulation allows for multi-layered substrates, without meshing the volume. This method has the advantages of easy meshing, simple implementation, and FFT-accelerated iterative methods. Also, a three-dimensional variant of this method allows for more complex substrate geometries than some other surface integral techniques, such as multilayered Green's functions; this three-dimensional problem and its solution are presented in parallel with the planar substrate problem and solution. Results from a C++ implementation are presented for the planar problem.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Anne M. Vithayathil.</dim:field>
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   <dim:field mdschema="dc" element="subject" lang="en_US">Electrical Engineering and Computer Science.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Substrate resistance extraction using a multi-domain surface integral formulation</dim:field>
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   	&lt;Title>Substrate resistance extraction using a multi-domain surface integral formulation&lt;/Title>
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   	&lt;PublicationDate>2004&lt;/PublicationDate>
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   	&lt;Abstract>In recent years, mixed-signal designs have become more pervasive, due to their efficient use of area and power. Unfortunately, with sensitive analog and fast digital circuits sharing a common, non-ideal substrate, such designs carry the additional design burden of electromagnetic coupling between contacts. This thesis presents a method that quickly extracts the electroquasistatic coupling resistances between contacts on a planar, rectangular, two-layer lossy substrate, using an FFT-accelerated multi-domain surface integral formulation. The multi-domain surface integral formulation allows for multi-layered substrates, without meshing the volume. This method has the advantages of easy meshing, simple implementation, and FFT-accelerated iterative methods. Also, a three-dimensional variant of this method allows for more complex substrate geometries than some other surface integral techniques, such as multilayered Green&amp;apos;s functions; this three-dimensional problem and its solution are presented in parallel with the planar substrate problem and solution. Results from a C++ implementation are presented for the planar problem.&lt;/Abstract>
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