2026-09-19T06:11:09Zhttps://dspace.mit.edu/server/oai/requestoai:dspace.mit.edu:1721.1/301802022-01-13T07:54:29Zcom_1721.1_7582com_1721.1_7581col_1721.1_131023
Clifton G. Fonstad, Jr.
Teo, Mindy Simin, 1981-
Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science.
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
2006-03-24T18:27:04Z
2006-03-24T18:27:04Z
2004
2005
http://hdl.handle.net/1721.1/30180
60679424
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2005.
Includes bibliographical references (p. 99-101).
The monolithic heterogeneous integration technology known as Recess Mounting with Monolithic Metallization (RM³) has been under study to integrate III-V heterostructures in the form of optopills on silicon CMOS circuits. Implementation of this technology poses several challenges such as recess filling and optopill bonding to the CMOS circuits. Research focused on establishing assembly techniques to overcome these challenges is performed. This thesis discusses the development of a vacuum tool pick- and-place technique as a solution to recess filling. A novel vacuum film bonding technique was also studied as a method of bonding the pills to the recesses. The results of this bonding technique as well as bonding experiments done using various metal stacks between the pills and recesses are also presented here.
by Mindy Simin Teo.
S.M.
101 p.
6169668 bytes
6181626 bytes
application/pdf
application/pdf
eng
Massachusetts Institute of Technology
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
http://dspace.mit.edu/handle/1721.1/7582
Electrical Engineering and Computer Science.
Development of pick-and-place assembly techniques for monolithic optopill integration
Thesis
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<Abstract>The monolithic heterogeneous integration technology known as Recess Mounting with Monolithic Metallization (RM³) has been under study to integrate III-V heterostructures in the form of optopills on silicon CMOS circuits. Implementation of this technology poses several challenges such as recess filling and optopill bonding to the CMOS circuits. Research focused on establishing assembly techniques to overcome these challenges is performed. This thesis discusses the development of a vacuum tool pick- and-place technique as a solution to recess filling. A novel vacuum film bonding technique was also studied as a method of bonding the pills to the recesses. The results of this bonding technique as well as bonding experiments done using various metal stacks between the pills and recesses are also presented here.</Abstract>
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