<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-24T19:35:24Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/32395" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/32395</identifier><datestamp>2022-01-13T07:54:36Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131024</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Alexander H. Slocum.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Werkmeister, Jaime Brooke, 1977-</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Dept. of Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Massachusetts Institute of Technology. Department of Mechanical Engineering</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2006-03-29T18:40:46Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="available">2006-03-29T18:40:46Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2005</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2005</dim:field>
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   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (Mech. E.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2005.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (p. 85-86).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">As demand for smaller devices continues to increase, current manufacturing processes will find it more challenging to meet cost, quantity, and dimensional requirements. While microfabrication technology processes can create electronic devices in vast quantities with increasingly smaller dimensions, they are challenged to do so for mechanical devices at low cost and in large quantity. More traditional manufacturing processes such as machining or injection molding can more easily meet cost and quantity requirements, but are unable to currently match the dimensional abilities of microfabrication processes. By merging microfabrication and traditional injection molding techniques, the benefits of both technologies can be combined to produce parts to meet all three requirements. The objective of this research is to investigate the possibilities of injection molding polymer parts with sub-micron three-dimensional features using a process called Silicon Insert Molded Plastics (SIMP).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Jaime Brooke Werkmeister</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">Mech.E.</dim:field>
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   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.</dim:field>
   <dim:field mdschema="dc" element="rights" qualifier="uri">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Development of silicon insert molded plastic (SIMP)</dim:field>
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   	&lt;Title>Development of silicon insert molded plastic (SIMP)&lt;/Title>
   	&lt;Subtitle>Development of SIMP&lt;/Subtitle>
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   	&lt;PublicationDate>2005&lt;/PublicationDate>
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    &lt;Keyword>Mechanical Engineering.&lt;/Keyword>
   	&lt;Abstract>As demand for smaller devices continues to increase, current manufacturing processes will find it more challenging to meet cost, quantity, and dimensional requirements. While microfabrication technology processes can create electronic devices in vast quantities with increasingly smaller dimensions, they are challenged to do so for mechanical devices at low cost and in large quantity. More traditional manufacturing processes such as machining or injection molding can more easily meet cost and quantity requirements, but are unable to currently match the dimensional abilities of microfabrication processes. By merging microfabrication and traditional injection molding techniques, the benefits of both technologies can be combined to produce parts to meet all three requirements. The objective of this research is to investigate the possibilities of injection molding polymer parts with sub-micron three-dimensional features using a process called Silicon Insert Molded Plastics (SIMP).&lt;/Abstract>
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