<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-19T19:11:59Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/32781" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/32781</identifier><datestamp>2022-01-13T07:54:36Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131024</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">John H. Lienhard, V.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Ruddy, Bryan P. (Bryan Paul), 1983-</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Dept. of Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Massachusetts Institute of Technology. Department of Mechanical Engineering</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2006-05-15T20:29:35Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="available">2006-05-15T20:29:35Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2004</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2004</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="uri">http://hdl.handle.net/1721.1/32781</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">57571337</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2004.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (p. 35).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">A design for the use of evacuated Perlite insulation in the shipment of perishable goods was analyzed, implemented, and evaluated, with the goal of replacing or reducing the amount of phase-change materials needed to ship such goods by standard package carriers. The package design makes use of inexpensive materials and relatively simple operations to completely surround perishable items in a layer of evacuated Perlite insulation, bounded by inner and outer bags of high-barrier film. A vacuum chamber and sealing apparatus were constructed in order to fabricate these evacuated Perlite packages, and a microcontroller-based temperature-logging sensor was developed and built for in-situ temperature measurement over several days' time span. Due to problems with the reliability of the fabrication apparatus and the package structure, no experimental data could be obtained to evaluate the performance of the package design with evacuated insulation. Control data validated the function of the temperature sensor, which may have applications to other projects. The package design still appears to be viable, but a more reliable sealing and evacuating apparatus must be constructed and a more robust way to package goods within the insulation layer must be devised.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Bryan P. Ruddy.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">S.B.</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">35 p.</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent">1912298 bytes</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent">1911598 bytes</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="mimetype">application/pdf</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="mimetype">application/pdf</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.</dim:field>
   <dim:field mdschema="dc" element="rights" qualifier="uri">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Design, fabrication and testing of low-cost vacuum insulated packaging</dim:field>
   <dim:field mdschema="dc" element="type" lang="en_US">Thesis</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="mimetype">application/pdf</dim:field>
   <dim:field mdschema="dspace" element="authorsordered">false</dim:field>
   <dim:field mdschema="dspace" element="entity" qualifier="type">Publication</dim:field>
   <dim:field mdschema="others" element="access-status">unknown</dim:field>
   <dim:field mdschema="others" element="access-status">unknown</dim:field>
   <dim:field mdschema="cerif" element="openaire" authority="" confidence="-1">&lt;Publication xmlns="https://www.openaire.eu/cerif-profile/1.1/" id="13bdf51f-67ae-4093-ad9f-077d446c9592">
	&lt;Type xmlns="https://www.openaire.eu/cerif-profile/vocab/COAR_Publication_Types">http://purl.org/coar/resource_type/c_1843&lt;/Type>
	&lt;Language>eng&lt;/Language>
   	&lt;Title>Design, fabrication and testing of low-cost vacuum insulated packaging&lt;/Title>
   	&lt;PublishedIn>
    	&lt;Publication>
      	&lt;/Publication>
   	&lt;/PublishedIn>
   	&lt;PublicationDate>2004&lt;/PublicationDate>
   	&lt;Authors>
      	&lt;Author>
        	&lt;DisplayName>Ruddy, Bryan P. (Bryan Paul), 1983-&lt;/DisplayName>
         	&lt;Affiliation>
         		&lt;OrgUnit>
         		&lt;/OrgUnit>
         	&lt;/Affiliation>
      	&lt;/Author>
	&lt;/Authors>
   	&lt;Editors>
	&lt;/Editors>
    &lt;Publishers>
        &lt;Publisher>
            &lt;DisplayName>Massachusetts Institute of Technology&lt;/DisplayName>
            &lt;OrgUnit />
        &lt;/Publisher>
    &lt;/Publishers>
    &lt;License>http://dspace.mit.edu/handle/1721.1/7582&lt;/License>
    &lt;Keyword>Mechanical Engineering.&lt;/Keyword>
   	&lt;Abstract>A design for the use of evacuated Perlite insulation in the shipment of perishable goods was analyzed, implemented, and evaluated, with the goal of replacing or reducing the amount of phase-change materials needed to ship such goods by standard package carriers. The package design makes use of inexpensive materials and relatively simple operations to completely surround perishable items in a layer of evacuated Perlite insulation, bounded by inner and outer bags of high-barrier film. A vacuum chamber and sealing apparatus were constructed in order to fabricate these evacuated Perlite packages, and a microcontroller-based temperature-logging sensor was developed and built for in-situ temperature measurement over several days&amp;apos; time span. Due to problems with the reliability of the fabrication apparatus and the package structure, no experimental data could be obtained to evaluate the performance of the package design with evacuated insulation. Control data validated the function of the temperature sensor, which may have applications to other projects. The package design still appears to be viable, but a more reliable sealing and evacuating apparatus must be constructed and a more robust way to package goods within the insulation layer must be devised.&lt;/Abstract>
	&lt;Access xmlns="http://purl.org/coar/access_right" 
    >
    &lt;/Access>
&lt;/Publication>
</dim:field>
</dim:dim>
</metadata></record></GetRecord></OAI-PMH>